Zero-second rapid curing, transparent and bubble-free, improving sample preparation efficiency.
UVmount employs high-intensity UV curing technology, which can quickly complete the polymerization reaction of cold-mounting resin, significantly shortening the waiting time required for traditional cold-mounting and providing a more efficient sample preparation solution for metallographic analysis, electronic material testing, and failure analysis.
During operation, simply place the sample into a special embedding mold, inject UV-specific transparent resin, and then place it inside the equipment for irradiation.Curing completes rapidly within 60 secondsImmediately proceed to the subsequent grinding and polishing process, effectively improving the work efficiency of laboratory and production quality testing.
Low-bubbling, high-quality sample preparation
The cured embedded specimens exhibit excellent transparency, allowing for clear observation of the sample's position and orientation, facilitating subsequent precise grinding and cross-sectional analysis. Simultaneously, it effectively reduces the probability of bubble formation, preventing embedding defects from affecting observation results and ensuring the preparation of high-quality specimens.
UV curing × Rapid embedding × Transparent and bubble-free
This reduces sample preparation time from tens of minutes to 60 seconds, enabling the rapid acquisition of high-quality transparent embedded samples.
Application field
- PCB cross-section analysis
- Semiconductor Packaging Analysis
- Electronic component testing
- Metallographic sample preparation
- Failure Analysis (FA)
- Quality Inspection Laboratory
- Academic research units
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Machine features:
(1) Automatic/electric opening and closing of hatch
(2) Realize "one-click start" to automatically complete the sample delivery and sample output process
(3) 4.3-inch touch screen display and operation
(4) The irradiation time can be set freely, and there are 4-position timing shortcut buttons
(5) Double-layer light sources with no blind spots
(6) Achieve uniform curing from the inside out
(7) The curing heat is low, and the highest temperature during curing is less than 90 degrees
(8) The temperature of the sample after curing is lower than 60 degrees
(9) Dual fan cooling system
Product Features
Ultra-fast curing
Using a high-efficiency UV light source, resin curing can be completed in as little as 60 seconds, significantly shortening the sample preparation time.
High transparency embedding effect
The cured resin has high transparency, making it easy to observe the sample position and grinding depth, thus improving the accuracy of subsequent analysis.
Low-bubbling, high-quality sample preparation
Special UV curing technology effectively reduces bubble formation, ensuring the integrity of the embedding and the quality of the cross-section.
Simple to operate and highly efficient
No need to wait a long time for the resin to harden; the embedding process can be completed quickly, improving laboratory work efficiency.
Suitable for a variety of materials
It is suitable for the preparation of electronic components, PCBs, semiconductor packaging, metal materials, ceramics, composite materials and various precision samples.
